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Xilinx Inc.(2351)
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Min Supply Voltage | Frequency | Width | Mounting Type | Operating Temperature | Technology | Height Seated (Max) | HTS Code | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Power Supplies | Supply Voltage-Max (Vsup) | Propagation Delay | Supplier Device Package | Core Architecture | Speed | Memory Type | Core Processor | RAM Size | Number of I/O | Boundary Scan | Data Bus Width | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | Clock Frequency | RAM (words) | UV Erasable | Number of Gates | Output Function | Programmable Type | Number of Macro Cells | Primary Attributes | JTAG BST | Voltage Supply - Internal | Number of Logic Elements/Blocks | Number of Logic Elements/Cells | Speed Grade | Number of Registers | Connectivity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| XA7Z030-1FBV484Q | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | Active | 4 (72 Hours) | 484 | EAR99 | ROHS3 Compliant | 484-BBGA, FCBGA | -40°C~125°C TJ | CMOS | 8542.39.00.01 | BOTTOM | BALL | YES | S-PBGA-B484 | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | Kintex™-7 FPGA, 125K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-1SB485I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Bulk | 2009 | Zynq®-7000 | no | Active | 2A (4 Weeks) | 485 | ROHS3 Compliant | GPIO WITH FOUR 32-BIT BANKS | 484-FBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.39.00.01 | BOTTOM | BALL | YES | S-PBGA-B485 | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | MCU, FPGA | DMA | 667MHz | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2CG-L2SBVA484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 484 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 484-BFBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B484 | 0.698V | 0.742V | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z015-1CL485I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Bulk | 2010 | Zynq®-7000 | no | Active | 2A (4 Weeks) | 485 | 19mm | Non-RoHS Compliant | 484-LFBGA, CSPBGA | 19mm | -40°C~100°C TJ | CMOS | 1.6mm | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B485 | 0.95V | 1.05V | 667MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; PCI; SPI; UART; USB | MCU, FPGA | DMA | 667MHz | 256000 | Artix™-7 FPGA, 74K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-2SBVA484I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 484 | ROHS3 Compliant | 484-BFBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | R-PBGA-B484 | 0.876V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 82 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-1SFVA625E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 625-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 180 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-1SBVA484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 484-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 82 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-3FBG676E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676 | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1GHz | 0°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z030 | YES | 1mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 125K Logic Cells | -3 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||
| XCZU3CG-2SBVA484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 484-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 82 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EG-1FBVB900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FBG676I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z045 | YES | 1mm | S-PBGA-B676 | 1.05V | ARM | ROMless | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||
| XCZU5EG-1SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-L2FFG676I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 27mm | ROHS3 Compliant | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 676-BBGA, FCBGA | 27mm | -40°C~100°C TJ | CMOS | 3.37mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 1mm | S-PBGA-B676 | 0.95V | 1.05V | 800MHz | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 800MHz | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||
| XC7Z035-3FFG676E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 27mm | ROHS3 Compliant | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 27mm | 0°C~100°C TJ | CMOS | 3.37mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 1mm | S-PBGA-B676 | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||
| XCZU4EG-L2FBVB900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 900 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 900-BBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B900 | 0.698V | 0.742V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU6CG-1FFVC900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4EG-L1FBVB900I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 900 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 900-BBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B900 | 0.698V | 0.742V | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 204 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3CG-1SFVA625I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 625-BFBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 180 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-L2FBG676I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2010 | Zynq®-7000 | Active | 3 (168 Hours) | 676 | 3A991.D | 27mm | ROHS3 Compliant | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 27mm | -40°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | YES | 1mm | S-PBGA-B676 | 0.95V | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||
| XC7Z045-1FFG676I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2009 | Zynq®-7000 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~100°C TJ | CMOS | 3.37mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z045 | 676 | YES | 1mm | S-PBGA-B676 | Other uPs/uCs/Peripheral ICs | 11.8V | 1.05V | ARM | ROMless | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | N | Kintex™-7 FPGA, 350K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||
| XCZU7CG-1FBVB900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ROHS3 Compliant | 900-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 256KB | 204 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XAZU2EG-1SFVA625Q | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | 21mm | ROHS3 Compliant | 625-BFBGA, FCBGA | 21mm | -40°C~125°C TJ | CMOS | 3.43mm | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B625 | 500MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 1.2MB | 128 | MPU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | CANbus, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-3FFG900E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Surface Mount | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | ROHS3 Compliant | Copper, Silver, Tin | 900-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 800MHz | 0°C~100°C TJ | CMOS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 245 | 1V | 30 | 1mm | S-PBGA-B900 | 90 ps | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 3 | 343800 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||
| XAZU3EG-1SFVC784Q | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | 23mm | ROHS3 Compliant | 784-BFBGA, FCBGA | 23mm | -40°C~125°C TJ | CMOS | 3.32mm | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | YES | 0.8mm | S-PBGA-B784 | 500MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 1.8MB | 128 | MPU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EV-2SFVC784I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU3EG-L2SFVA625E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 625-BFBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B625 | 0.698V | 0.742V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 180 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU6EG-1FFVB1156E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 1156-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 328 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4EV-2SFVC784E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | yes | Active | 4 (72 Hours) | ROHS3 Compliant | 784-BFBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 252 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z014S-2CLG484E | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | 10 Weeks | Tray | 2014 | Zynq®-7000 | Active | 3 (168 Hours) | ROHS3 Compliant | 484-LFBGA, CSPBGA | 0°C~100°C TJ | 484-CSPBGA (19x19) | 766MHz | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 200 | MCU, FPGA | DMA | Artix™-7 FPGA, 65K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC9536-10PC44I | Xilinx Inc. | $0.00 |
Min: 1 Mult: 1 |
download | Surface Mount | Tube | 1996 | XC9500 | no | Obsolete | 3 (168 Hours) | 44 | EAR99 | 5V | Non-RoHS Compliant | Contains Lead | No | 44 | YES | 44-LCC (J-Lead) | Surface Mount | -40°C~85°C TA | CMOS | 66.7MHz | e0 | QUAD | J BEND | 225 | 5V | 30 | XC9536 | 44 | Programmable Logic Devices | 10 ns | FLASH | 34 | 800 | MACROCELL | In System Programmable (min 10K program/erase cycles) | 36 | YES | 4.5V~5.5V | 2 | 8 | 10 |