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RF/IF & RFID
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Thermal Management
Img
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Rfq |
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Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
|
976 |
24-TSSOP (0.173, 4.40mm Width) |
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Linear Technology/Analog Devices |
16-TFSOP (0.118, 3.00mm Width) Thermal Management 4.039mm mm
|
410 |
16-TFSOP (0.118, 3.00mm Width) |
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NXP USA Inc. |
8-WFDFN Exposed Pad Thermal Management
|
427 |
8-WFDFN Exposed Pad |
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Analog Devices Inc. |
14-CDIP (0.300, 7.62mm) Thermal Management 5V V17.78mm mmContains Lead
|
462 |
14-CDIP (0.300, 7.62mm) |
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NXP USA Inc. |
8-WFDFN Exposed Pad Thermal Management
|
404 |
8-WFDFN Exposed Pad |
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Linear Technology/Analog Devices |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management 3mm mm
|
532 |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) |
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Linear Technology/Analog Devices |
48-LQFP Thermal Management
|
137 |
48-LQFP |
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Maxim Integrated |
8-SOIC (0.154, 3.90mm Width) Thermal Management 4.9mm mmLead Free
|
394 |
8-SOIC (0.154, 3.90mm Width) |
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|
Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
|
468 |
24-TSSOP (0.173, 4.40mm Width) |
|
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|
|
Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
|
429 |
24-TSSOP (0.173, 4.40mm Width) |
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Maxim Integrated |
16-SSOP (0.154, 3.90mm Width) Thermal Management 5.5V V4.98mm mmLead Free
|
162 |
16-SSOP (0.154, 3.90mm Width) |
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Analog Devices Inc. |
TO-100-10 Metal Can Thermal Management 9.4mm mmContains Lead
|
769 |
TO-100-10 Metal Can |
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|
Linear Technology/Analog Devices |
48-LQFP Thermal Management
|
315 |
48-LQFP |
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Maxim Integrated |
16-SSOP (0.154, 3.90mm Width) Thermal Management
|
968 |
16-SSOP (0.154, 3.90mm Width) |
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Maxim Integrated |
16-WQFN Exposed Pad Thermal Management 3.6V V5mm mm
|
197 |
16-WQFN Exposed Pad |
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NXP USA Inc. |
Thermal Management
|
214 |
- |
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Renesas Electronics America Inc. |
8-WFDFN Exposed Pad Thermal Management
|
950 |
8-WFDFN Exposed Pad |
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Microchip Technology |
24-SSOP (0.154, 3.90mm Width) Thermal Management 3.3V V8.6487mm mm
|
540 |
24-SSOP (0.154, 3.90mm Width) |
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NXP USA Inc. |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9mm mm
|
662 |
16-SSOP (0.154, 3.90mm Width) |
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STMicroelectronics |
8-WFDFN Exposed Pad Thermal Management 3.6V VLead Free
|
366 |
8-WFDFN Exposed Pad |
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|
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Analog Devices Inc. |
14-CDIP (0.300, 7.62mm) Thermal Management 5V V17.78mm mmContains Lead
|
434 |
14-CDIP (0.300, 7.62mm) |
|
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|
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Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mmLead Free
|
627 |
24-TSSOP (0.173, 4.40mm Width) |
|
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|
Texas Instruments |
24-TSSOP (0.173, 4.40mm Width) Thermal Management Lead Free
|
632 |
24-TSSOP (0.173, 4.40mm Width) |
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Integrated Device Technology (IDT) |
Thermal Management 3.6V V2mm mmLead Free
|
758 |
- |
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Integrated Device Technology (IDT) |
DFN Thermal Management 3.6V V2mm mmLead Free
|
721 |
DFN |
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Integrated Device Technology (IDT) |
DFN Thermal Management 3.3V V2mm mmLead Free
|
501 |
DFN |
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ANALOG DEVICES INC |
Thermal Management
|
490 |
- |
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