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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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Microsemi Corporation |
-40°C~125°C TJ System On ChipAutomotive, AEC-Q100, SmartFusion?2 Series 195 I/O
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768 |
400-LFBGA |
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Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S025 System On ChipSmartFusion?2 Series 207 I/O
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630 |
400-LFBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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871 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V
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260 |
484-BGA |
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Microsemi Corporation |
0°C~85°C TJ System On ChipSmartFusion?2 Series 233 I/O
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116 |
484-BGA |
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Microsemi Corporation |
325 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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792 |
325-TFBGA, CSPBGA |
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Microsemi Corporation |
325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 180 I/O1.2V
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388 |
325-TFBGA, CSPBGA |
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Intel |
484 Terminations-40°C~100°C TJ System On ChipCyclone? V SE Series MCU - 151, FPGA - 66 I/O1.1V
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635 |
484-FBGA |
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Intel |
484 Terminations-40°C~100°C TJ 5CSEBA2 System On ChipCyclone? V SE Series MCU - 151, FPGA - 66 I/O1.1V
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655 |
484-FBGA |
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Xilinx Inc. |
484 Terminations0°C~85°C TJ 2 Pin XC7Z020 System On ChipZynq?-7000 Series 130 I/O1V Min 1.2V VMax 3.3V V
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554 |
484-LFBGA, CSPBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O
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631 |
784-BFBGA, FCBGA |
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Xilinx Inc. |
225 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 54 I/O1V
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577 |
225-LFBGA, CSPBGA |
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Xilinx Inc. |
400 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 100 I/O1V
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903 |
400-LFBGA, CSPBGA |
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Xilinx Inc. |
784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 252 I/O0.85V
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594 |
784-BFBGA, FCBGA |
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Microsemi Corporation |
-40°C~100°C TJ 256 Pin A2F200 System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V
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651 |
256-LBGA |
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Xilinx Inc. |
900 Terminations-40°C~100°C TJ 900 Pin XC7Z100 System On ChipZynq?-7000 Series 212 I/O1V
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316 |
900-BBGA, FCBGA |
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Xilinx Inc. |
484 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 200 I/O1V
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960 |
484-LFBGA, CSPBGA |
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Xilinx Inc. |
484 Terminations0°C~100°C TJ 484 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V
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947 |
484-BBGA, FCBGA |
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Microsemi Corporation |
0°C~85°C TJ 400 Pin M2S005 System On ChipSmartFusion?2 Series 169 I/O
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411 |
400-LFBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 204 I/O
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409 |
900-BBGA, FCBGA |
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Xilinx Inc. |
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC CG Series 82 I/O
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201 |
484-BFBGA, FCBGA |
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Microsemi Corporation |
484 Terminations-40°C~100°C TJ 484 Pin System On ChipSmartFusion?2 Series 233 I/O1.2V
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731 |
484-BGA |
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Xilinx Inc. |
485 Terminations0°C~85°C TJ System On ChipZynq?-7000 Series 150 I/O1V
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167 |
484-LFBGA, CSPBGA |
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Seeed Technology Co., Ltd |
-30°C~85°C System On ChipSipeed MAIX-I Series 48 I/O
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760 |
Module |
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Seeed Technology Co., Ltd |
-30°C~85°C System On ChipSipeed MAIX-I Series 48 I/O
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396 |
Module |
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Xilinx Inc. |
400 Terminations-40°C~100°C TJ System On ChipZynq?-7000 Series 125 I/O1V
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561 |
400-LFBGA, CSPBGA |
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Microsemi Corporation |
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 161 I/O1.2V
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998 |
256-LFBGA |
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Xilinx Inc. |
676 Terminations-40°C~100°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V
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150 |
676-BBGA, FCBGA |
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Microsemi Corporation |
256 Terminations-40°C~100°C TJ 256 Pin System On ChipSmartFusion?2 Series 138 I/O1.2V Min 1.14V VMax 1.26V V
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481 |
256-LFBGA |
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Xilinx Inc. |
900 Terminations-40°C~100°C TJ XC7Z045 System On ChipZynq?-7000 Series 130 I/O1V
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542 |
900-BBGA, FCBGA |
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