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Part Number
Manufacturers
Desc
In Stock
Packing
Rfq
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
763
256-LBGA
Microsemi Corporation
484 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 233 I/O1.2V
175
484-BGA
Microsemi Corporation
256 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
635
256-LFBGA
Microsemi Corporation
0°C~85°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/OMin 1.425V VMax 1.575V V
752
256-LBGA
Microsemi Corporation
-40°C~100°C TJ 400 Pin M2S010T System On ChipSmartFusion?2 Series 195 I/O
853
400-LFBGA
Microsemi Corporation
0°C~85°C TJ 484 Pin M2S010 System On ChipSmartFusion?2 Series 233 I/OMin 1.14V VMax 1.26V V
594
484-BGA
Xilinx Inc.
676 Terminations0°C~100°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V
739
676-BBGA, FCBGA
Microsemi Corporation
0°C~85°C TJ 400 Pin M2S010T System On ChipSmartFusion?2 Series 195 I/O
447
400-LFBGA
Microsemi Corporation
256 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 138 I/O1.2V
110
256-LBGA
Microsemi Corporation
400 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 195 I/O1.2V
602
400-LFBGA
Microsemi Corporation
0°C~85°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O
886
288-TFBGA, CSPBGA
Microsemi Corporation
0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O
359
144-LQFP
Microsemi Corporation
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
687
144-LQFP
Microsemi Corporation
0°C~85°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O
517
288-TFBGA, CSPBGA
Microsemi Corporation
0°C~85°C TJ 484 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 41, FPGA - 128 I/OMin 1.425V VMax 1.575V V
565
484-BGA
Microsemi Corporation
0°C~85°C TJ System On ChipSmartFusion?2 Series 213 I/O
114
144-LQFP
Microsemi Corporation
288 Terminations-40°C~100°C TJ A2F500M3G System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O1.5V
576
288-TFBGA, CSPBGA
Microsemi Corporation
-40°C~100°C TJ M2S010TS System On ChipSmartFusion?2 Series 233 I/O
739
484-BGA
Microsemi Corporation
-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O
661
256-LBGA
Microsemi Corporation
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
926
144-LQFP
Microsemi Corporation
-40°C~100°C TJ M2S100 System On ChipSmartFusion?2 Series 574 I/O1.2V
801
1152-BBGA, FCBGA
Microsemi Corporation
144 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
543
144-LQFP
Microsemi Corporation
-55°C~125°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/OMin 1.425V VMax 1.575V V
137
256-LBGA
Microsemi Corporation
-55°C~125°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V
524
1152-BBGA, FCBGA
Microsemi Corporation
-55°C~125°C TJ System On ChipSmartFusion?2 Series 574 I/O1.2V
782
1152-BBGA, FCBGA
Broadcom Limited
System On Chip
892
-
Microsemi Corporation
144 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 84 I/O1.2V
424
144-LQFP
Microsemi Corporation
-40°C~100°C TJ 208 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 22, FPGA - 66 I/OMin 1.425V VMax 1.575V V
931
208-BFQFP
Microsemi Corporation
256 Terminations-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/O1.5V
736
256-LBGA
Xilinx Inc.
484 Terminations0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 82 I/O0.9V
408
484-BFBGA, FCBGA